Details

SAI-10C Bessel Cutting Head

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Core Advantages:


High-precision Optical Design: The lens group optimizes the optical path to achieve excellent cutting effects.


Long-focus Deep Processing: The depth of focus can reach up to 13mm (under typical working conditions), making it suitable for processing thick materials.


High-damage-resistant Lenses: With a damage threshold of 12J/cm², it supports the stable operation of picosecond/femtosecond lasers.

Main Application:

Glass and Cubic Zirconia cutting

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Parameter

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Technical Parameters:


  • Wavelength: 1030-1070nm

  • Depth of Focus: 10mm (Input Spot Size: 12mm, Light Transmittance: 99%)

  • Maximum Input Spot Size: 12mm

  • Working Distance: 30mm

  • Applicable Lasers: Picosecond/Femtosecond lasers with PSO module and Burst mode


Installation and Debugging:


  • Installation: Fix vertically with M6 screws, ensuring it is firmly locked with the processing surface for stable cutting.

  • Debugging: Conduct coaxial and concentric calibration (using special tools) to ensure the accuracy of the optical path. Professional operation is recommended.


Maintenance Suggestions:


  • Cleaning: Wipe the upper and lower protective lenses unidirectionally with alcohol once a week to remove impurities.

  • Replacement: Replace the vulnerable lenses in a timely manner when they are damaged to ensure the cutting quality.


Application Scenarios:
Precision material processing (such as glass, FPC/PCB, etc.), enabling efficient cutting of complex curves and thick materials.
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